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根据热敏电阻的温度特性给出互换热敏电阻的定义。互换性用互换精度△R/R=(1+△A/A)[(B_2-B_1)/T+1/2(B_2-B_1)/T)~2]表之。本文结合实验结果讨论掺金硅、本征锗、氧化物半导体热敏电阻一致性与材料参数的关系,并讨论这些材料的热敏机理。最后简要叙述元件结构参数对一致性的影响,以提供设计和制作互换性元件的一般依据。
The definition of interchangeable thermistors is given based on the temperature characteristics of the thermistor. Interchangeability with the exchange of precision △ R / R = (1 + △ A / A) [(B_2-B_1) / T + 1/2 (B_2-B_1) / T) ~ 2 Table. In this paper, we discuss the relationship between the conformance of the gold-doped silicon, intrinsic germanium and oxide semiconductor thermistors and the material parameters based on the experimental results and discuss the thermosensitive mechanism of these materials. Finally, the effect of component structure parameters on consistency is briefly described to provide a general basis for the design and fabrication of interchangeable components.