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采用扫描电镜和微型拉伸试验机,研究了冷却速度对Sn-Pb钎料合金组织和性能的影响。为了得到不同冷却速度下的Sn-Pb合金,将Sn-Pb合金在300℃下熔化,分别直接在25、50、100和150℃的重油中冷却成固态。研究结果表明:冷却速度越小,Sn-Pb钎料合金的组织越大,当钎料合金在25℃重油中冷却时,钎料合金富Pb相的大小为8.7μm,而当钎料合金在150℃重油中冷却时,钎料合金富Pb相的大小为22.2μm;冷却速度越小钎料合金的强度越高,当钎料合金在25℃重油中冷却时,钎料合金的抗拉强度为26.36 MPa,而当钎料合金在150℃重油中冷却时,钎料合金的抗拉强度为31.84 MPa;钎料合金拉伸断口均表现为韧窝结构,韧窝大小随着冷却速度的降低而逐渐增大。
The effects of cooling rate on the microstructure and properties of Sn-Pb solder alloy were investigated by scanning electron microscopy and micro tensile testing machine. In order to obtain Sn-Pb alloys at different cooling rates, the Sn-Pb alloys were melted at 300 ° C and directly cooled to solid state at 25, 50, 100 and 150 ° C in heavy oil, respectively. The results show that the smaller the cooling rate is, the larger the microstructure of the Sn-Pb solder alloy. When the solder alloy is cooled in heavy oil at 25 ℃, the Pb-rich phase size of the solder alloy is 8.7μm, When the heavy oil is cooled at 150 ℃, the Pb-rich phase size of the solder alloy is 22.2μm. The smaller the cooling rate, the higher the solder alloy strength. When the solder alloy is cooled in heavy oil at 25 ℃, the tensile strength Is 26.36 MPa, while when the solder alloy is cooled in heavy oil at 150 ℃, the tensile strength of the solder alloy is 31.84 MPa; the tensile fracture of the solder alloy shows dimple structure, the dimple size decreases with the cooling rate And gradually increased.