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采用热等静压(HIP)固固扩散连接工艺,研究了K497与FGH741合金经HIP连接及热处理后母材的组织变化、结合界面的组织、力学性能及界面区元素的扩散规律。结果表明,在HIP和热处理阶段,FGH741合金未发生再结晶,其晶粒度与母材基本相同,均为ASTM5～6级;K497合金的粗大枝晶组织和共晶相经热处理后基本消除。结合界面冶金结合良好,形成了一个由亚晶和再结晶晶粒组成的界面区且无有害相析出。结合试样的室温力学性能达到了技术要求,但塑性值偏低。结合界面两侧元素相互扩散的趋势明显。
The hot-isostatic pressing (HIP) solid-state diffusion bonding process was used to study the microstructure and mechanical properties of K497 and FGH741 alloy after HIP connection and heat treatment. The microstructure, mechanical properties and diffusion rules of interface elements were studied. The results show that no recrystallization of FGH741 alloy occurs during the HIP and heat treatment stages, and the grain size of the FGH741 alloy is basically the same as that of the base metal, both of which are ASTM5 ~ 6. The coarse dendritic structure and eutectic phase of K497 alloy are basically eliminated after heat treatment. The metallurgical bonding interface is well bonded, forming an interfacial region composed of subgrain and recrystallized grains without precipitation of harmful phases. Combined with the room temperature mechanical properties of the sample to meet the technical requirements, but the plastic value is low. The trend of mutual diffusion of elements on both sides of the interface is obvious.