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嵌入式共固化复合材料阻尼结构层间易脱层问题的解决对这种新型阻尼结构的应用来说至关重要。本文根据中温固化玻璃纤维/环氧树脂复合材料固化工艺参数,提出用正交实验法研究嵌入复合材料层中的粘弹性阻尼薄膜的组分,探索用刷涂工艺在预浸料表面刷涂不同厚度的阻尼薄膜,然后利用固化工艺制作嵌入式共固化复合材料试件,最后通过阻尼层剪切实验,获得阻尼薄膜厚度与层间最大剪切应力的变化曲线。失效界面分析说明刷涂工艺制成的阻尼薄膜与玻璃纤维/环氧树脂预浸料共固化反应后在层间形成互穿网络结构(IPN)和物理融合,这使得嵌入式共固化复合材料具有更好的层间结合性能。
The solution to the problem of easy delamination between the layers of the embedded co-cured composite damping structure is of crucial importance for the application of this new damping structure. Based on the curing process parameters of medium temperature curing glass fiber / epoxy composites, the orthogonal experimental method is proposed to study the composition of the viscoelastic damping films embedded in the composite layer, and to explore the application of brushing process on the surface of the prepreg Thickness of the damping film, and then use the curing process to make embedded co-cured composite specimens, and finally through the damping layer shear test to obtain the damping film thickness and the maximum shear stress between the layers. Failure interface analysis shows that the IPN and physical fusion between the layers after the caking reaction of the damping film made of the brushing process with the glass fiber / epoxy prepreg results in the embedded co-cured composite having Better interlayer bonding performance.