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据信息产业部提供的资料,我国“十五”期间将重点发展的电子元器件如下: 1.表面贴装元器件重点发展贱金属电极片式陶瓷电容器,片式电阻器,片式电感器,片式钽电容器和片式二、三极管。 2.厚膜混合集成电路(HIC)重点开发和生产为通信产品、汽车电子等投资类整机配套的产品以及
According to the information provided by the Ministry of Information Industry, the electronic components that will be mainly developed during the “Tenth Five-year Plan” in our country are as follows: 1. Surface mount components are mainly focused on the development of base metal chip ceramic capacitors, chip resistors, chip inductors, Chip tantalum capacitors and chip two, transistor. 2. Thick film hybrid integrated circuit (HIC) focus on the development and production of communications products, automotive electronics and other investment products supporting the entire machine and