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无机粘接技术,经过十余年的发展、巩固和提高,现已成功地用于许多方面。这种粘接剂,具有操作简便、经济等优点,当选用合理的结构时,可获得较高的粘接强度。无机粘接剂虽然种类繁多,但目前常用的是一种以特制的氧化铜粉和经过特殊处理的磷酸溶液为基础的无机粘接剂。上述药品按一定的调和比例,放在光滑的铜板或玻璃板上,均匀调,和成稀糊状,即可进行粘接。无机粘接剂的粘接机理,有化学键力和吸附力的作用。也由于粘接剂嵌于粗糙表面峰谷间和微孔内形成十分可观的机械作用力,这就构成被粘接物与粘接剂间非常可观的强度。
Inorganic bonding technology, after more than ten years of development, consolidation and improvement, has been successfully used in many ways. This adhesive, with easy operation, economic advantages, the election of a reasonable structure, access to higher adhesive strength. Although a wide range of inorganic adhesives, but now commonly used is a special copper oxide powder and specially treated phosphoric acid solution based on the inorganic adhesive. The above drugs by a certain degree of reconciliation, on a smooth copper or glass, even transfer, and into a thin paste, can be bonded. The bonding mechanism of inorganic adhesives, the role of chemical bonding and adsorption force. Since the adhesive is embedded in the rough surface between the peaks and valleys and pores to form a considerable mechanical force, which constitutes a considerable adhesion between the adhesive and adhesive strength.