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在低碳钢表面利用脉冲电源进行辉光离子渗Ti工艺研究。结果表明:在本工艺条件下,能够获得200μm以上的渗层,其组织形貌为渗层与基体之间形成一条明显的反应扩散分界线,且分界线两边均出现较为明显的柱状晶;渗Ti层的结构主要由Fe2Ti、Fe-Ti、TiC相组成;随着电压的升高,渗Ti层增加,550V时达到最厚,表面Ti含量也最高,当电压超过550V后,渗层厚度减小、Ti含量降低;随时间的增长,渗Ti层厚度增加,表面Ti的含量增加;渗层厚度随温度的升高而变厚,渗层Ti的含量也随之变大。
Study on glow plasma infiltration Ti process by using pulse power on the surface of mild steel. The results show that under this condition, the infiltrated layer with the thickness of 200μm can be obtained. The microstructure of the interface is that there is a clear demarcation boundary between the diffusion layer and the matrix, and obvious columnar crystals appear on both sides of the demarcation line. The structure of Ti layer mainly consists of Fe2Ti, Fe-Ti and TiC phases. With the increase of voltage, the seepage Ti layer increases and reaches the thickest at 550V, with the highest Ti content. When the voltage exceeds 550V, the thickness of the diffusion layer decreases The content of Ti increases with the increase of time, and the thickness of Ti increases with the increase of temperature. The content of Ti increases with the increase of temperature.