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环路热管由于其出色的传热性能,正在成为高热流密度电子芯片散热的前沿技术。本文制作了一种以铜为外壳、水为工质的大功率平板式环路热管,并研究了热泄漏对环路热管传热特性的影响。通过降低毛细结构的等效热导可以有效降低热泄漏,使环路热管有更好的传热性能。结果显示,本文所制环路热管在传达距离为80 cm的时候,最大功率可达150 W以上,此时热阻约为0.08℃/W。最低启动功率为2 W,不存在启动困难的问题。
Due to its excellent heat transfer performance, loop heat pipes are becoming the cutting-edge technology for heat dissipation of high heat flux density electronic chips. In this paper, a high-power flat-plate loop heat pipe with copper as the shell and water as the working fluid was fabricated. The effect of heat leakage on the heat transfer characteristics of the loop heat pipe was also studied. By reducing the equivalent capillary thermal conductivity can effectively reduce the heat leak, the loop heat pipe has better heat transfer performance. The results show that the loop heat pipe made in this paper can reach a maximum power of 150 W or more at a transmission distance of 80 cm, and the thermal resistance is about 0.08 ° C / W. The minimum start-up power is 2 W, there is no start-up problems.