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JPCA最新出版了《印制线路板用无卤型覆铜箔酚醛树脂纸层压板JPCA-ES02-2007》《印制线路板用无卤型覆铜箔玻纤布面·玻纤纸芯·复合基材环氧树脂层压板JPCA-ES03-2007》《印制线路板用无卤型覆铜箔玻纤布·环氧树脂层压板JPCA-ES04-2007》《多层印制线路板用无卤型覆铜箔玻纤布·环氧树脂层压板JPCA-ES05-2007》《多层印制线路板用无卤型玻纤布·环氧树脂粘结片JPCA-ES06-2007》五个有关无卤型覆铜箔板方面的标准,马明诚将其翻译为中文,供行业同仁学习参考,以促进无卤型CCL行业的发展。
JPCA recently published the “halogen-free copper-clad phenolic resin paper laminates for circuit boards JPCA-ES02-2007”, the “halogen-free” copper clad fiberglass fiberglass cloth and fiberglass cores for printed circuit boards Substrate Epoxy Resin Laminate JPCA-ES03-2007 “” Halogen-free copper-clad laminate for printed circuit boards Fiberglass Epoxy Resin Laminate JPCA-ES04-2007 “” Multi-layer PCB with Halogen Free Copper-clad Fiberglass Cloth · Epoxy Resin Laminate JPCA-ES05-2007 “” Non-halogen Fiberglass Cloth / Epoxy Adhesive Sheet JPCA-ES06-2007 for Multilayer Printed Wiring Board " Halogen-based copper clad laminate standards, Ma Mingcheng translated into Chinese for colleagues in the industry to learn the reference to promote the development of halogen-free CCL industry.