在局部地区网络和用户回路的一些应用中,要求低成本,高性能、牢固的发射机和接收机封装。前几年,就实现了混合小型化模块,这是一种把硅双极IC技术和InGaAsP LED或InGaAs PIN二极管组合在一起的器件。下一代混合器件是与GaAs IC的结合。不久的将来,单片光电集成电路将具有发射机和接收机的功能。 In some applications of local area networks and subscriber loops, low cost, high performance, robust transmitter and receiver packaging is required. A few years ago, a hybrid miniaturization module was implemented, a device that combines silicon bipolar IC technology with InGaAsP LED or InGaAs PIN diodes. The next generation hybrid is a combination of GaAs ICs. In the near future, monolithic optoelectronic integrated circuits will have transmitter and receiver functions.