随着电脑芯片即CPU处理数据的速度越来越快,芯片发热成了越来越突出的问题,现有的散热方式已经不能给高速的芯片降温了。于是,一些科学家想到了用液体循环冷却芯片,虽然液体的流动使散热加快了一些,但是由于液体遇热容易蒸发而产生气泡,这些气泡会附着在芯片表面,使热量更难以散发。 As computer chips, that is, CPUs, process data faster and faster, the chip heating becomes an increasingly prominent issue. The existing cooling methods have not been able to cool high-speed chips. As a result, some scientists have come to mind that the liquid is used to cool the chip. Although the flow of liquid accelerates the heat dissipation, bubbles are attached to the surface of the chip because the liquid easily evaporates when it is heated, making the heat more difficult to dissipate.