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聚合物材料通常都是热绝缘体,但美国研究人员通过电聚合过程使聚合物纤维排成整齐阵列,形成一种新型热界面材料,导热性能在原有基础上提高了20倍。新材料能够在高达200℃的温度下可靠操作,可用于散热片中帮助服务器、汽车、高亮度LED(发光二极管)中的电子设备散热。该研究成果提前发表在近日《自然纳米技术》杂志网络版上。随着电子设备功能越来越强、体型越来越小,散热问题也变得越来越复杂。工程师们一直在寻找更好的热界面材料,来帮助电子设备有效散热。非晶态聚合物材料是热
Polymer materials are usually thermal insulators, but American researchers make polymer fibers neatly arrayed by electropolymerization to form a new type of thermal interface material with a 20-fold increase in thermal conductivity. The new materials operate reliably at temperatures up to 200 ° C and can be used in heatsinks to help dissipate heat from electronics in servers, automobiles, and high-brightness LEDs (light-emitting diodes). The research results published in advance in the recent “Nature Nanotechnology” magazine online version. As electronic devices become more powerful, smaller and smaller, thermal issues have become more complex. Engineers are always looking for better thermal interface materials to help the electronics cool down effectively. Amorphous polymer material is hot