论文部分内容阅读
随着微加工技术和微分析技术的发展,人们已经可以把大型的机电系统或者光学系统微型化并进行某种程度的集成。但是,由于光学元件和光学系统对微结构的材料性能、几何尺寸和表面质量等都有极为苛刻的要求,光学系统特别是自由空间光学系统的微型化仍然面临巨大的技术挑战。提出一种基于表面压印和三维铸模技术的自由空间光学系统集成技术,该技术解决了光学元件的微型化及层内和层间的光学互联;在此基础上,结合MEMS技术、印刷电路(PCB)和表面贴装(SMD)技术实现了片上的光机电混合集成。
With advances in micromachining and microanalysis, people have been able to miniaturize and integrate large electromechanical or optical systems to some extent. However, due to the extremely harsh requirements of the optical elements and optical systems on the material properties, geometrical dimensions and surface qualities of the microstructures, the miniaturization of optical systems, especially free-space optical systems, still poses enormous technical challenges. A free space optical system integration technology based on surface stamping and three-dimensional mold casting technology is proposed, which solves the miniaturization of optical components and the optical interconnection between layers and layers. On the basis of this, combining the MEMS technology, the printed circuit PCB) and surface mount (SMD) technologies enable on-chip optomechanical integration.