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以含Me2Si O链节的环状聚甲基苯基硅氧烷、八甲基环四硅氧烷为共聚单体,四甲基氢氧化铵为催化剂、二乙烯基四甲基二硅氧烷为封端剂,采用阴离子型聚合法制备了不同Mr(相对分子质量)的甲基苯基乙烯基硅胶;然后以此为原料(二甲基硅氧链节与甲基苯基硅氧链节是均匀分布的),合成了耐高温室温固化有机硅胶粘剂。研究结果表明:改变封端剂的掺量可有效调节硅胶的Mr;苯基分散均匀的硅胶与普通硅胶相比,前者的黏度明显降低,并且前者所得有机硅胶粘剂具有更好的耐热性(失重5%时的温度为459.48℃)和粘接性能。
Cyclic polymethylphenylsiloxane containing Me2SiO link, octamethylcyclotetrasiloxane as comonomer, tetramethylammonium hydroxide as catalyst, divinyltetramethyldisiloxane As the capping agent, different molecular mass (Mr) methyl phenyl vinyl silica gel was prepared by anionic polymerization method; then as raw materials (dimethyl siloxane and methylphenyl siloxane Is evenly distributed), synthesis of high temperature room temperature curing silicone adhesive. The results show that: the change of the amount of end-capping agent can effectively adjust the silica gel Mr; phenyl-dispersed silica gel compared with ordinary silica gel, the former significantly reduced the viscosity, and the former silicone adhesive has better heat resistance The temperature at 5% weight loss is 459.48 ° C) and the bonding properties.