一年来,射频和微波工程行业研制和开发了很多新的产品,以下简要归纳了其中最主要的一些产品。下面所列出的16个产品中每一个产品背后的整个团队都是值得大家称贺的。快速增长的通信市场上的激烈竞争促使有些制造厂商重新审视一些电子基本原则,如封装和电路布局等。L3 Communications、Nadrda Microwave-East公司的单片微波表面贴装(MMSM)封装工艺可在高频端最大程度地提高PIN管和变容二极管的性能。 In the past year, many new products have been developed and developed by the radio frequency and microwave engineering industries. The following briefly summarizes some of the major products. The whole team behind each of the 16 products listed below is worthy of your respect. Fierce competition in the fast-growing communications market has prompted some manufacturers to re-examine some of the basic principles of electronics such as packaging and circuit layout. L3 Communications, Nadrda Microwave-East’s single-chip microwave surface-mount (MMSM) packaging process maximizes pin and varactor performance at the high-frequency end.