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沿晶断裂是指沿不同取向的晶粒所形成的晶粒界面分离,其断口为沿晶断日。沿晶断裂是由于材料的晶界被弱化而成为裂纹扩展的优先通道,这种断裂常呈脆性行为。造成沿晶断裂的原因常有以下几种:(1)晶界沉淀相析出:(2)杂质元素的晶界偏析;(3)环境因素引起(如氢脆及应力腐蚀):(4)热应力引起(如高温蠕变)。沿晶断裂按其断裂机理常可分为韧性沿晶断裂及脆性沿晶断裂,通常情况下上述(1)、(4)两种
Intergranular fracture refers to the separation of grain boundaries formed by grains oriented in different orientations, and the fracture is the intergranular fracture. Intergranular fracture is due to the material of the grain boundary is weakened as a crack propagation priority channel, this fracture often brittle behavior. Causes of intergranular fracture are often the following: (1) precipitation of precipitated grain boundaries: (2) grain boundary segregation of impurity elements; (3) environmental factors (such as hydrogen embrittlement and stress corrosion): (4) heat Stress caused (such as high temperature creep). Intergranular fracture according to its fracture mechanism can often be divided into toughness intergranular fracture and brittle fracture along the crystal, under normal circumstances (1), (4) two