一、VLSI发展的技术基础——微电子学半导体集成电路发展已历经20个年头,由于微电子学进步,从IC、LSI几乎直线升到VLSI。硅平面加工技术,70年代初为8μm技术,80年代初为2μm技术,到了85年就已进入0.1μm超微细加工技术开发日程。从集成度增加率看,70年代中比60年代初每年增加2倍,此后每三年增加四倍。若以含元件数为10~5个的单片集成水平为VLSI水平,从图1中 First, the technical basis for the development of VLSI - Microelectronics semiconductor integrated circuit development has gone through 20 years, due to the progress of microelectronics, IC, LSI almost straight line rose to VLSI. Silicon planar processing technology, early 70s for the 8μm technology, early 80s 2μm technology, to 85 years have entered the 0.1μm ultrafine processing technology development schedule. Judging from the rate of increase in integration, the number increased twice as often in the mid-1970s than in the early 1960s and quadrupled every three years thereafter. If the number of components with 10 ~ 5 monolithic integration level VLSI level, from Figure 1