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手机RF是手机最核心的元器件之一,也是在技术上最难以驾驭和控制的部分。在无线通信3G时代的背景下,手机RF技术向集成化、数字化、多频多模方向发展。对RF芯片技术的不断完善与升级已经成为3G手机设计射频方案的关键。然而随着手机尺寸的不断减小以及用户对手机性能期待度的提高,传统手机集成电路和组件逐渐成为无线通信发展的限制。在这种技术瓶颈下,专注于生产手机薄膜材料的Paratek公司引起了业界的关注。Paretek公司专注于专用可调谐RF材料技术的研究,生产可改善手机性能的集成电路和组件,同时也可以减少天线等手机组件的数量和尺寸,满足了每一个RF的前端需求标准。
Mobile phone RF is one of the core components of mobile phones, but also the most technically difficult to control and control part. In the era of wireless communication 3G era, mobile RF technology has been developed towards integration, digitization and multi-frequency multimode. The continuous improvement and upgrading of RF chip technology has become the key to the design of RF solutions for 3G handsets. However, as cell phone sizes continue to decrease and user expectations for cell phone performance increase, traditional cell phone integrated circuits and components have become the limiting factor in the development of wireless communications. In this technology bottleneck, Paratek company specializing in the production of mobile phone film material aroused the industry’s attention. Paretek Corporation specializes in the research of specialized tunable RF materials technology to produce integrated circuits and components that improve handset performance while also reducing the number and size of handset components such as antennas to meet the RF front-end requirements of every standard.