论文部分内容阅读
3月6日,德州仪器(TI)宣布推出最新接口芯片系列FlatLink3G,为手持电子设备带来真彩与高分辨率的视频内容。FlatLink3G串行器与解串器可在液晶显示器(LCD)与移动应用处理器(如TI被广泛采用的OMAPTM平台)之间建立起高速接口。其主要针对移动应用的超低电压差分信号(subLVDS)串行
March 6, Texas Instruments (TI) announced the introduction of the latest interface chip family FlatLink3G, for handheld electronic devices bring true color and high resolution video content. FlatLink3G serializers and deserializers establish a high-speed interface between liquid crystal displays (LCDs) and mobile application processors such as TI’s widely adopted OMAPTM platform. Its primary focus is on ultraLow voltage differential signaling (subLVDS) serial for mobile applications