天津冶金材料研究所采用特殊工艺,研制成功无银焊片。可以广泛应用于低压电器触点与触桥间的银焊工艺,取代传统工艺中的银焊片。新焊片具有流动性能好、熔点较低、焊缝强度高、导电性能优异等特点,节银效果十分显著。电器型式试验结果表明;温升、热稳定、电寿命、接通及通断能力、可逆转换等性 Tianjin Institute of Metallurgical Materials using a special process, the successful development of silver solder pieces. It can be widely used in the silver welding process between the low voltage electrical contact and the touch bridge to replace the silver solder piece in the traditional process. New solder with good flow properties, low melting point, high weld strength, excellent conductivity and other characteristics of section silver effect is very significant. Electrical type test results show that; temperature rise, thermal stability, electrical life, turn on and off capacity, reversible conversion isotropic