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钨铜复合材料因低膨胀系数、高导热性,可有效传输集成电路产生的热量,从而延长电路的使用寿命。铜包覆钨复合粉体有利于钨铜复合材料的综合性能的提高。采用间歇式电镀法成功制备出钨铜包覆粉体,研究了不同电镀时间对复合粉体表面形貌、镀层厚度、含铜量以及铜镀层沉积速率的影响以及铜镀层的形成机理。结果表明,制备出的复合粉体为铜包钨核壳结构,铜镀层均匀、致密,表面粗糙度小;在电流密度为1.7 A/dm~2的条件下,电镀30和75 min的平均镀层厚度分别为0.69和1.96μm,含铜量分别为9.97%和23.76%,沉积速率分别为36.91和41.34 mg·min~(-1),镀层厚度、沉积速率均随电镀时间的增加而增加;铜镀层的形核和长大遵循Volmer-Weber模式。
Tungsten-copper composite materials due to low expansion coefficient, high thermal conductivity, can effectively transfer heat generated by integrated circuits, thereby extending the life of the circuit. Copper coated tungsten composite powder is conducive to the comprehensive performance of tungsten-copper composite materials to improve. The tungsten-copper coated powder was successfully prepared by intermittent electroplating method. The effects of different electroplating time on the surface morphology, coating thickness, copper content and the deposition rate of copper coating and the formation mechanism of copper coating were studied. The results show that the prepared composite powder is a copper clad tungsten core-shell structure, the copper coating is uniform and compact, and the surface roughness is small. At the current density of 1.7 A / dm ~ 2, the average coating thickness is 30 and 75 min With the thicknesses of 0.69 and 1.96 μm, respectively, with the contents of 9.97% and 23.76% respectively. The deposition rates were 36.91 and 41.34 mg · min -1, respectively. The thickness and deposition rate of the coatings increased with the increase of plating time. The nucleation and growth of the coating follow the Volmer-Weber pattern.