【摘 要】
：
A novel low-cost and high-speed via filling method using Cu-cored solder balls was investigated for through-silicon via manufacture.Cu-cored solder balls with a
【机 构】
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Institute of Microelectronics,Chinese Academy of Sciences,Jiangsu R&D Center for Internet of Things,
论文部分内容阅读
A novel low-cost and high-speed via filling method using Cu-cored solder balls was investigated for through-silicon via manufacture.Cu-cored solder balls with a total diameter of 100μm were used to fill 150μm deep,110μm wide vias in silicon.The wafer-level filling process can be completed in a few seconds,which is much faster than using the traditional electroplating process.Thermo-mechanical analysis of via filling using solder,Cu and Cu-cored solder was carried out to assess the thermo-mechanical properties of the different filling materials.It was found that the vias filled with Cu-cored solder exhibit less thermal-mechanical stresses than solder-filled vias, but more than Cu-filled vias.
A novel low-cost and high-speed via filling method using Cu-cored solder balls was investigated for through-silicon via manufacture. Cu-cored solder balls with a total diameter of 100 μm were used to fill 150 μm deep, 110 μm wide vias in silicon The wafer-level filling process can be completed in a few seconds, which is much faster than using the traditional electroplating process. Thermo-mechanical analysis of via filling using solder, Cu and Cu-cored solder was carried out to assess the thermo- mechanical properties of the different filling materials. It was found that the vias filled with Cu-cored solder exhibit less thermal-mechanical stresses than solder-filled vias, but more than Cu-filled vias.
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