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以10~12 mm厚致密Al2O3陶瓷为研究对象,采用CO2激光,以离散通孔密排分离新技术,实现了厚板陶瓷直线、曲线等自由加工路径的激光无损切割。采用扫描电镜(SEM)和激光共聚焦显微分析方法研究了切缝表面的熔凝层结构,评价了无损切割的良好质量。以激光切割过程的高速摄像CCD分析为基础,对激光峰值功率、占空比、频率、打孔时间等特征工艺参数进行了优化分析,给出了厚度不小于10 mm致密陶瓷激光无损切割的优化工艺参数,脉冲峰值功率2.7~3.5 kW,脉冲频率约50 Hz,脉冲占空比30%~50%,通孔时间0.1~0.5 s。该技术直线切割速度可达15~20 mm/min。
Taking the 10 ~ 12 mm thick Al2O3 ceramic as the research object, the CO2 laser was used to separate the new technology through the discrete through-hole close-row separation to realize the laser non-destructive cutting of the free-machining path such as the straight line and the curve of the thick plate ceramic. The fused layer structure of the kerf surface was studied by scanning electron microscopy (SEM) and confocal laser scanning microscopy, and the good quality of non-destructive cutting was evaluated. Based on the high-speed CCD imaging analysis of the laser cutting process, the characteristic process parameters such as laser peak power, duty ratio, frequency and punching time were optimized and analyzed, and the optimization of the non-destructive cutting of the dense ceramic laser with a thickness of not less than 10 mm The process parameters are pulse peak power 2.7 ~ 3.5 kW, pulse frequency about 50 Hz, pulse duty cycle 30% ~ 50% and via time 0.1 ~ 0.5 s. The technology linear cutting speed of up to 15 ~ 20 mm / min.