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随着 IC技术的进步 ,集成电路芯片不断向高集成化、高密度化及高性能化方向发展。传统的硅片制造技术主要适应小直径 ( Φ≤ 2 0 0 mm)硅片的生产 ;随着大直径硅片的应用 ,硅片的超精密磨削得到广泛的应用。本文主要论述了小直径硅片的制造技术以及适应大直径硅片生产的硅片自旋转磨削法硅片磨削的加工原理和工艺特点。
With the progress of IC technology, integrated circuit chips continue to be highly integrated, high density and high performance. Conventional wafer fabrication technology is mainly suitable for the production of small diameter (Φ ≤ 200 mm) wafers. With the application of large diameter wafers, ultra-precision grinding of wafers is widely used. This article mainly discusses the manufacturing technology of small-diameter silicon wafer and the processing principle and process characteristics of the silicon wafer grinding by the self-rotating silicon wafer grinding method adapted to the production of large diameter silicon wafer.