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本文介绍用铟焊料把大功率晶体管焊在散热板上的方法。与普通的螺丝固定方法相比较,新的铟焊接法可以增大器件的输出功率,而且更换器件方便。铟焊料的熔点温度较低,只有141℃,而普通焊料的熔点温度是181℃,因此更换大功率晶体管时不会影响其他的元件。铟焊料接点位于大功率晶体管的底面和散热板之间(见图)。散热板是用来散发晶体管的热量,以免
This article describes the use of indium solder to the high-power transistor soldered in the heat sink on the method. Compared with ordinary screwing method, the new indium welding method can increase the output power of the device, and the replacement of the device is convenient. Indium solder has a lower melting temperature of 141 ° C, compared with 181 ° C for normal solder, so replacing high-power transistors does not affect the other components. Indium solder joints are located between the underside of the high-power transistor and the heatsink (see figure). Heat sink is used to distribute the heat of the transistor, so as to avoid