塑封工序中塑封材料和注塑压强是影响叠层固体铝电解电容器的两个主要因素。具有柔性好(韧性强度好)的塑封料,流动长度长,与芯片摩擦力小,高温(140-195度之间)黏度小以及固化收缩率小的高纯度塑封料将对芯子产生更小的冲击力。在一定注塑压强范围内,注塑压强越小,产品漏电流合格率越高,ESR也越小。 Plastic molding process plastic molding materials and injection pressure is the impact of laminated solid electrolytic capacitors two main factors. With good flexibility (good toughness) of the plastic material, long flow length, small friction with the chip, high temperature (140-195 degrees) low viscosity and curing shrinkage of small high-purity plastic material will have a smaller core The impact. Within a certain injection pressure range, the smaller the injection pressure, the higher the pass rate of the product leakage current, the smaller the ESR.