据报导,美帝国际商业机器公司用铝—铜进行合金(铜的合金仅百分之几)以提高集成电路互连引线的可靠性。实际上,加上铜是为了减缓所谓的“电子移动”过程,这种“电子移动”产生了许多电“空洞”,它们在铝互连引线的测试中可以观察到。这些“空洞”是导致集成电路失效的主要原因之一。“电子移动”包括在大电流密度下电流方向中的铝原子的位移。这种位移可以看作是电子碰撞的结果。在集成电路典型的工作温度下,由于晶界无规则结 It is reported that the US imperial International Business Machines company with aluminum - copper alloy (copper alloys only a few percent) to improve the reliability of integrated circuit interconnection leads. In fact, copper is added to slow the so-called “electron-moving” process, which produces a lot of electrical “voids” that can be observed in the testing of aluminum interconnects. These “holes” are one of the major causes of failure of integrated circuits. “Electron movement” includes the displacement of aluminum atoms in the current direction at high current densities. This displacement can be seen as the result of an electron collision. At typical IC operating temperatures, there is no regular junction due to the grain boundaries