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随着组装密度的提高,暴露出了许多传热问题。为了避免代价高的反复设计,设计者宁可在设计开始前就考虑基本的传热原理。使用者适应的BASIC传热程序成功地解了电子组装中遇到的传热问题,而其计算精度可与热网络分析程序这样大的热程序相比。 这些BASIC程序能使工程师们在家或办公室完成他们的热分析。其程序容量仅受所用计算机的有效存储器的限制。在此用来说明程序的例题考虑到机箱中各个热耗散电子器件的热模型。此热模型用到典型的传导、对流和辐射传热机理。
As assembly density increases, many heat transfer issues are exposed. To avoid costly iterative design, designers prefer to consider the basic heat transfer principle before design begins. The user-adapted BASIC heat transfer program successfully solves heat transfer problems encountered in electronics assembly, and its computational accuracy can be compared to such a large thermal program as thermal network analysis programs. These BASIC programs enable engineers to complete their thermal analysis at home or in the office. Its program capacity is limited only by the available memory of the computer in use. The example used to illustrate the procedure here takes into account the thermal model of each heat dissipating electronic device in the chassis. This thermal model uses typical conduction, convection and radiative heat transfer mechanisms.