论文部分内容阅读
空间的热真空环境是造成光电子器件胶接材料性能退化和放气污染的重要因素。为此,考察了几类典型胶接材料的热真空老化和热真空挥发特性,分析了热真空老化后的力学性能变化及真空挥发产物的主要来源,并对热真空挥发预处理方法进行了验证。结果表明软质的硅橡胶与硬质的环氧树脂胶和丙烯酸树脂胶相比有着更大的质量损失,且含有端羟基的缩聚型硅橡胶和环氧树脂胶真空老化后的模量变化较大。通过真空预处理可以作为降低固化胶真空挥发产物来源的一种有效手段。可为宇航用光电子器件胶接材料的设计选型提供参考依据。
The thermal vacuum environment is an important factor that causes the degradation of the performance of the bonding materials of the optoelectronic devices and the bleed air pollution. In this paper, the thermal vacuum aging and thermal vacuum evaporation of several typical adhesive materials were investigated. The change of mechanical properties after thermal vacuum aging and the main sources of vacuum volatiles were analyzed. The thermal vacuum evaporation pretreatment method was also verified . The results show that the soft silicone rubber has a greater mass loss than the hard epoxy resin and the acrylic resin, and the change of the modulus after the vacuum aging of the polycondensation type silicone rubber and the epoxy resin containing hydroxyl groups Big. Vacuum pretreatment can be used as an effective means of reducing the source of vacuum volatilization of the cured adhesive. For aerospace materials used in the design of adhesive bonding materials provide a reference.