在0.25×0.25英寸的硅片上装45万个晶体管的32位单片处理器即将问世,说明半导体工艺已发展到了可在国防部的高速集成电路计划(此计划的主要目的是实现实时信号处理的应用)中加以应用的水平。HP公司为制作处理器研究了一种高性能N沟道MOS工艺,这种工艺使器件只有1.5微米大小,线路间距为1.0微米。微程序处理器工作在18 The forthcoming introduction of a 32-bit monolithic processor with 450,000 transistors on a 0.25 by 0.25 inch silicon wafer indicates that the semiconductor process has evolved into a high-speed integrated circuit plan available at the Department of Defense (the main purpose of this program is to enable real-time signal processing Application) to the level of application. HP Corp. researched a high-performance N-channel MOS process for fabricating a processor that enabled the device to be only 1.5 microns in size with a trace pitch of 1.0 microns. Microprocessors work at 18