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二维视觉系统已成功地用在表面组装电子工业中,它可以用来进行可靠的识别和元件装配。然而,第三维——高度方向,正变得越来越重要,这是由SMT的特性及元器件尺寸的减小所决定的。对于有些参数,如IC引线的高度和焊膏的厚度,必须加以严格的控制,才能保证高生产效率。丝网印刷工艺开始时,将金属模板置于印制的电路板上,模板窗孔正好处在需要焊膏处,即与焊盘位置相对应,然后把焊膏施于模板上,并移动刮板将其压入模板窗孔,再把模板拿走。这样,从理论上讲就可以准备贴装元件了。
Two-dimensional vision systems have been successfully used in the surface-mount electronics industry for reliable identification and component assembly. However, the third dimension - the height direction - is becoming more and more important as it is determined by the characteristics of SMT and the reduction in component size. For some parameters, such as the height of the IC leads and the thickness of the solder paste, it must be strictly controlled in order to ensure high production efficiency. At the beginning of the screen printing process, the metal template is placed on the printed circuit board, the template window is at the place where the solder paste is needed, that is to say corresponding to the position of the pad, and then the solder paste is applied to the template and the scraping The board will be pressed into the template window, and then remove the template. In this way, in theory, you can prepare the placement of components.