监控和消除隐藏的电路缺陷已成为130nm和130nm以下器件的关键。这使得电子束检查正在广泛应用于开发、试生产和量产的监控过程。我们将描述当前铜逻辑和晶圆代工厂电子束检查技术的执行情况,其中包括详细的案例研究,它说明了从开发到量产过程中应用电子束检查技术的好处。我们也描述了过去克服通用工具障碍的方法。然后,分别介绍了利用电子束检查技术的新进展,以及为假设的20000WSPMφ300mm工厂模拟的最理想执行情况的最佳实例。 Monitoring and eliminating hidden circuit defects has become the key to devices under 130nm and 130nm. This makes e-beam inspection is widely used in development, pilot production and mass production monitoring process. We describe the current state of implementation of the copper logic and foundry e-beam inspection techniques, including detailed case studies that illustrate the benefits of applying e-beam inspection techniques from development to mass production. We also describe ways in the past to overcome the obstacles of common tools. Then, new advances in the use of electron beam inspection techniques, as well as the best examples of ideal execution for a hypothetical 20000WSPMφ300mm factory simulation, were introduced.