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利用粉末冶金法真空热压烧结制备了SiCp/Cu复合材料,利用激光脉冲法测试了室温下复合材料的导热性能。研究发现,随着SiCp体积含量的增加,热导率逐渐下降,特别是当SiCp体积分数大于30%以后热导率急剧下降。复合材料的内部缺陷、基体Cu和SiCp颗粒之间的热膨胀失配以及界面反应是影响热导率的主要微观因素。要获得良好导热性能的SiCp/Cu复合材料,应该严格控制SiCp颗粒的体积分数在15%~30%之间。尽量提高致密度,减少烧结体内的位错、空隙等缺陷。
SiCp / Cu composites were prepared by powder metallurgy vacuum hot-pressing sintering. The thermal conductivity of composites at room temperature was measured by laser pulse method. The results show that with the increase of SiCp volume fraction, the thermal conductivity decreases gradually, especially when the volume fraction of SiCp is more than 30%. The internal defects of the composites, the thermal expansion mismatch between matrix Cu and SiCp particles and the interfacial reaction are the main microscopic factors that affect the thermal conductivity. To get good thermal conductivity of SiCp / Cu composites, SiCp particles should be strictly controlled volume fraction of 15% to 30%. As much as possible to improve the density and reduce the dislocation of the sintered body, such as gaps.