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用磁控溅射方法沉积制备的Ag/Ti-W/Ni-Cr三层复合电极薄膜上的Ag膜在工艺中容易脱落,而SiO2衬底上的Ag膜则具有良好的粘附性能。X射线衍射方法常用来检测薄膜中的应力,用X射线衍射技术(XRD)衍射峰位置的移动可判断膜中出现的是压应力还是张应力。实验中,用XRD对三层复合薄膜作了薄膜的应力分析,确定在160℃溅射沉积后,Ag膜中存在压应力,该应力使Ag膜(111)晶面间距(d)比SiO2衬底上的Ag膜晶面间距小约0.35%。采用500℃,15 min N2热退火的方法,可使三层复合膜中Ag膜的XRD峰位回复到与SiO2衬底上Ag膜相同的谱峰位置,说明采用热退火的方法可有效消除复合膜的应力,防止Ag膜的脱落。
The Ag film deposited on the Ag / Ti-W / Ni-Cr three-layer composite electrode deposited by magnetron sputtering method is easy to fall off during the process, while the Ag film on the SiO2 substrate has good adhesion performance. X-ray diffraction method is commonly used to detect the stress in the film, X-ray diffraction (XRD) diffraction peak position of the movement can be judged in the film is compressive stress or tensile stress. In the experiment, the stress of thin films was analyzed by XRD. It was found that there was compressive stress in the Ag film after sputtering deposition at 160 ℃. The stress made the interplanar spacing (d) of Ag film (111) The bottom of the Ag film spacing of about 0.35%. Using the method of N2 thermal annealing at 500 ℃ for 15 min, the XRD peak of the Ag film in the three-layer composite film can be restored to the same peak position of the Ag film on the SiO2 substrate, indicating that the method of thermal annealing can effectively eliminate the complex The stress of the film prevents the Ag film from falling off.