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下一代智能手机为进一步减少其产品厚度，将需要非常薄的多层印制板。文章叙述了薄的任意层积层HDI板之三种不同的制造方法，对用这三种不同方法制造的测试样板进行相关可靠性测试，以确认制造高端智能手机用PCB技术的有效性。三种试验板均为八层积层板，整体厚度小于0.5mm。进行了再流焊试验、高低温循环试验、高加速应力试验，比较它们的可靠性优劣。“,”The next generation of smartphones will demand very thin multilayer boards to reduce product thickness. This paper shows three different manufacturing approaches which can be used for very thin, any-layer build-ups. The technology approaches are compared on reliability level. The applied test boards comprise an eight-layer build-up with total board thickness below 0.5mm. The reliability performance of thin PCBs is three test methods that are relfow sensitivity testing and temperature cycling test and HAST test. The results obtained from reliability testing are summarized and compared within this paper.