采用Gleeble-1500热模拟机研究了Cu-Zn-Se-Bi-Sn合金在变形温度为550～700℃,变形速度为0.1s-1时的流变应力变化规律,利用TEM观察了该合金的位错结构。结果表明:Cu-Zn-Se-Bi-Sn合金高温动态再结晶明显降低了合金的流变应力,变形量在0.15～0.8时,流变应力趋于稳定;Cu-Zn-Se-Bi-Sn合金中存在Bi2Se3相,当变形温度低于700℃时,因其钉扎作用造成局部位错密度高,使变形过程中的流变应力增加。 The flow stress of Cu-Zn-Se-Bi-Sn alloy was investigated by using Gleeble-1500 thermal simulator at deformation temperature of 550-700 ℃ and deformation rate of 0.1s-1. Dislocation structure. The results show that the dynamic recrystallization of Cu-Zn-Se-Bi-Sn alloy significantly reduces the flow stress of the alloy, and the flow stress tends to be stable when the deformation is between 0.15 and 0.8. The Bi2Se3 phase exists in the alloy. When the deformation temperature is lower than 700 ℃, the local dislocation density is high due to the pinning effect, and the flow stress in the deformation process increases.