与生活中的任何事情一样,电路设计也免不了要作出牺牲和折衷.芯片设计人员通常必须综合考虑各种参数如速度、面积、可测试性和功率.由于需要尽快上市和降低成本,设计问题变得更为复杂.又如,用于解决电路设计问题的设计工具也存在自己的许多顾此失彼的问题.设计人员常面临方法抉择上的困惑,今天的FPGA设计人员就是如此.问题的根源是FPGA结构太多、差别太大.造成这种情况的原因是FPGA采用了许多工艺技术,其中包括SRAM和防熔技术.基本结构从细粒结构到粗粒结构应有尽有.器件的这些物理差别带来了许许多多的速度和集成度选择余地和很不相同的逻辑选配方法. As with everything in life, circuit design is inevitable at the expense and trade-offs that chip designers often have to take into account a wide range of parameters such as speed, area, testability, and power. Design issues are changing due to the need to go public and reduce costs Again, the design tools used to solve circuit design problems have many of their own problems. Designers often face the confusion of method choices, as today’s FPGA designers are. The root cause of the problem is the FPGA architecture Too many, the difference is too large. The reason for this is that FPGAs employ many process technologies, including SRAM and antifuse technology. The basic structure is everything from fine to coarse structures. Much more speed and integration options and very different logic matching method.