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对半导体器件要求可靠性高而数量少的场合,我们发现,一般获得器件的方法有不足的地方。本文提出一种获得方法,成本低、适应新型器件、能保证各个器件的可靠性。虽然这个方法主要应用于硅平面晶体管,但也能推广到其他类型的半导体器件。厂家及其工艺对这个方法作了严格的评价。把从各个扩散晶片得来的器件划分成若干组,对这些组进行选择试验,以便发现可能的失效机构。试验可以包括简单的电测试或文中详述的一些技术,如扫描电子显微镜和X-射线微探针分析。加拿大-美国通讯技术卫星计划已经采用了这一方法。
For semiconductor devices requiring high reliability and a small number of applications, we have found that there are deficiencies in the general method of obtaining a device. This paper presents a method of obtaining, low cost, to adapt to new devices, to ensure the reliability of each device. Although this method is mainly applied to silicon planar transistors, it can be generalized to other types of semiconductor devices. The manufacturer and its process made a rigorous evaluation of this method. The devices from each diffused wafer were divided into groups and the groups were selected for testing in order to identify possible failure mechanisms. Experiments may include simple electrical tests or some of the techniques detailed in the text, such as scanning electron microscopy and X-ray microprobe analysis. This approach has been adopted by Canada-United Telecommunications Technology Satellite Program.