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用Ｔｉ箔在１ ３２３ Ｋ 进行Ｓｉ３Ｎ４ 与Ｎｉ之间的连接，并对连接界面区的微观形貌、成分分布和界面反应产物进行了分析研究． 结果表明：通过Ｎｉ与Ｔｉ之间的相互扩散，在Ｓｉ３Ｎ４ 表面形成浸润良好的Ｔｉ－Ｎｉ液体合金，实测Ｔｉ－２８Ｎｉ共晶合金１ ３２３ Ｋ 时在Ｓｉ３Ｎ４ 表面的浸润角为９°． 基于ＥＤＸ，ＸＲＤ 测定结果和热力学分析，确定界面结构为：Ｓｉ３Ｎ４／ＴｉＮ（反应层Ⅰ）／Ｔｉ５Ｓｉ３＋ Ｔｉ５Ｓｉ４＋ Ｎｉ３Ｓｉ（反应层Ⅱ）／Ｎｉ－Ｔｉ化合物层／Ｎｉ固溶体／Ｎｉ． 反应层Ⅰ和反应层Ⅱ均随连接时间的增加而增厚，但反应层Ⅱ的成长速率和厚度明显高于反应层Ⅰ． 这种界面结构形式在０．９～７．２ ｋｓ 的连接时间范围内始终没有发生变化．
The connection between Si3N4 and Ni was carried out with Ti foil at 1 323 K, and the microstructure, composition distribution and interfacial reaction products were analyzed. The results show that the wetted Ti-Ni liquid alloy is formed on the surface of Si3N4 through interdiffusion between Ni and Ti. The measured infiltration angle of Si3N4 on Ti-28Ni eutectic alloy is 9 °. Based on the results of EDX, XRD and thermodynamic analysis, the interfacial structure was determined as: Si3N4 / TiN (reaction layer I) / Ti5Si3 + Ti5Si4 + Ni3Si (reaction layer II) / Ni-Ti compound layer / Ni solid solution / Ni. The reaction layer Ⅰ and reaction layer Ⅱ both thicken with the increase of the connection time, but the growth rate and thickness of the reaction layer Ⅱ were obviously higher than that of the reaction layer Ⅰ. This form of interface structure in the 0.9 ~ 7.2 ks connection time range has not changed.