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一、前言半导体音频功率放大器的设计与技术,自开始时算起,已经有近40年的历史了。回顾这一发展过程,可以简单地说明如下。早在60年代以前,真空管功率放大器一直占着主导地位,其工作类别采用A类(甲类)或AB类(甲乙类),并由变压器与负载耦合。这一趋势,随着半导体技术的发展,可认为终止于真正可靠的半导体管达到了合理价格之时。随后,使用锗器件的设计首先出现,但是,锗管由于在一般的高温时容易损坏
I. INTRODUCTION The design and technology of semiconductor audio power amplifiers have been in existence for nearly 40 years from the beginning. Reviewing this development can be briefly explained as follows. As early as the 1960s, the vacuum tube power amplifier has dominated, and its working categories using Class A (Class A) or Class AB (Class B), and the transformer coupled with the load. This trend, with the development of semiconductor technology, can be considered terminated at the time when the true reliability of the semiconductor reaches a reasonable price. Subsequently, the use of germanium device design first appeared, however, germanium tube due to the general high temperature easily damaged