论文部分内容阅读
1.前言所谓微薄电阻合金箔材系指厚度为数μ的箔材。这种合金箔材的种类颇多,依材质分、大约有铜基合金、镍铬基合金、铁铬铝基合金及钛、铂钨合金等。应用较广的有锰铜、康铜和卡玛箔等。对合金性能的要求依使用环境不同而异、不外乎是厚度均匀、表面光洁、平整无孔,且通过控制成份、加工率、热处理制度提高箔材的电性能。最为常用的合金箔厚度大约为3～5μ。本文主要叙述目前国内外各种微薄电阻合金箔材的应用情况。
1. Preface The so-called meager resistance alloy foil refers to the thickness of a few μ of foil. This type of alloy foil quite a lot, depending on the material points, about copper-based alloys, nickel-chromium-based alloys, iron-chromium-aluminum-based alloys and titanium, platinum and tungsten alloys. Manganese copper is widely used, such as copper and copper foil and so on. The performance requirements of the alloy varies with the use of the environment, nothing more than a uniform thickness, smooth surface, non-porous formation, and by controlling the composition, processing rate, heat treatment system to improve foil electrical properties. The most commonly used alloy foil thickness of about 3 ~ 5μ. This article mainly describes the current application of a variety of meager resistance alloy foil at home and abroad.