【摘 要】
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Based on the research of modern electronic packaging materials,thixo-forming technology was used to fabricate electronic packaging shell.The process of thixo-ex
【机 构】
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School of Materials Science and Engineering,East China Research Institute of Electronic Engineering
论文部分内容阅读
Based on the research of modern electronic packaging materials,thixo-forming technology was used to fabricate electronic packaging shell.The process of thixo-extrusion with SiCp/A356 composites was simulated by the finite element software DEFORM-3D,then the flow velocity field,equivalent strain field and temperature field were analyzed.The electronic packaging shell was manufactured by extrusion according to the results from numerical simulation.The results show that thixo-forming technology can be used in producing electronic package shell with SiCp/A356 composites,and high volume fraction of SiCp with homogeneous distribution can be achieved,being in agreement with the requirements of electronic packaging materials.
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