Dual-band RF receiver for GPS-L1 and compass-B1 in a 55-nm CMOS

来源 :Journal of Semiconductors | 被引量 : 0次 | 上传用户:BruceLee_123
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A fully integrated dual-band RF receiver with a low-IF architecture is designed and implemented for GPS-L1 and Compass-B1 in a 55-nm CMOS process. The receiver incorporates two independent IF channels with 2 or 4 MHz bandwidth to receive dual-band signals around 1.57 GHz respectively. By implementing a flexible frequency plan,the RF front-end and frequency synthesizer are shared for the dual-band operation to save power consumptionandchiparea,aswellasavoidingLOcrosstalk.Adigitalautomaticgaincontrol(AGC)loopisutilized to improve the receiver’s robustness by optimizing the conversion gain of the analog-to-digital converter(ADC).While drawing about 20 mA per channel from a 1.2 V supply,this RF receiver achieves a minimum noise figure(NF) of about 1.8 dB,an image rejection(IMR) of more than 35 dB,a maximum voltage gain of about 122 dB,a gain dynamic range of 82 dB,and an maximum input-referred 1 dB compression point of about –36.5 dBm with an active die area of 1.5 1.4 mm2 for the whole chip. A fully integrated dual-band RF receiver with a low-IF architecture is designed and implemented for GPS-L1 and Compass-B1 in a 55-nm CMOS process. The receiver incorporates two independent IF channels with 2 or 4 MHz bandwidth to receive dual -band signals around 1.57 GHz respectively. By implementing a flexible frequency plan, the RF front-end and frequency synthesizer are shared for the dual-band operation to save power consumption and chiparea, aswellasavoidingLOcrosstalk.Adigitalautomaticgaincontrol (AGC) loopisutilized to improve the receiver’s robustness by the conversion gain of the analog-to-digital converter (ADC) .While drawing about 20 mA per channel from a 1.2 Vsupply, this RF receiver achieves a minimum noise figure (NF) of about 1.8 dB, an image rejection (IMR) of more than 35 dB, a maximum voltage gain of about 122 dB, a gain dynamic range of 82 dB, and an maximum input-referred 1 dB compression point of -36.5 dBm with an active die area of ​​1.5 1.4 mm2 for the wholechip.
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