采用抗拉强度作为键合质量评价的指标,对硅-玻璃阳极键合的键合温度、冷却速度、退火温度和时间等四个参数的三个位级下的键合效果进行了分析。通过采用正交试验分析法,将81组试验减少为9组并进行了试验。采用自制的抗拉强度测试机对强度进行了测试,结果发现,阳极键合后的冷却速度对强度的影响最为显著,冷却速度越低,强度越高。最后对断裂面进行了SEM分析并对试验结果进行了讨论。 Tensile strength was used as an index to evaluate bonding quality. The bonding effects of three bonding levels of four parameters of bonding temperature, cooling rate, annealing temperature and time of silicon-glass anode bonding were analyzed. By using orthogonal test analysis, 81 groups of tests were reduced to 9 groups and tested. The self-made tensile strength tester was used to test the strength. The results showed that the cooling rate after anodic bonding had the most significant effect on the strength. The lower the cooling rate, the higher the strength. Finally, the fracture surface was analyzed by SEM and the test results were discussed.