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现有半导体制冷材料的生产主要采用区熔法和粉末冶金法，材料的生产成本高，制备工艺复杂，而且目前应用的单晶材料存在着脆性大、机械强度低、易解理、结构和性能存在各向异性等不足，给材料的加工、应用都造成困难，限制和影响了半导体制冷技术的进一步发展和应用。针对这一
The existing production of semiconductor refrigeration materials mainly adopts the zone melting method and the powder metallurgy method. The production cost of the material is high and the preparation process is complicated. The single crystal material currently used has the advantages of large brittleness, low mechanical strength, easy cleavage, structure and performance The existence of anisotropy and other shortcomings, the processing of materials, applications have caused difficulties, limiting and affecting the further development and application of semiconductor refrigeration technology. For this one