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通过对结晶器铜板与保护渣颗粒微元体接触点模型分析,并结合摩擦与磨损黏附理论分析实际生产中铜板受磨损的影响因素。进而通过改善保护渣的性能与铜板镀层,来延长结晶器铜板的寿命,提高铸坯质量。
Based on the model analysis of contact point between mold copper particles and mold powder particles and the friction and wear adhesion theory, the influence factors of copper plate wear in actual production were analyzed. And then by improving the performance of mold flux and copper coating, to extend the life of mold copper, improve the quality of slab.