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本文就高速光电器件微波封装提出了有希望的几种复合传输线(微带+共面线,屏蔽微带+共面线,微带+不对称共面线),采用边界元法计算了它们的特性阻抗,给出了几组有工程价值的计算曲线,并讨论了实验结果.
In this paper, several promising composite transmission lines (microstrip + coplanar line, shielded microstrip + coplanar line, microstrip + asymmetric coplanar line) are proposed for high speed optoelectronic device microwave packaging. Boundary Element Method The characteristic impedance gives several sets of calculation curves with engineering value, and discusses the experimental results.