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采用同基合金电弧离子镀方法,在紫铜基体上制备了Cu-Ti合金薄膜,研究了弧电流和靶-基距离对膜层质量、沉积速率的影响。结果表明,镀层沉积速率随着弧电流的增加而增大,随靶-基距离的增大而下降;镀层近表面为层片状组织,镀层表面有颗粒存在,显示电弧源后期喷射的是Cu-Ti合金液滴;近界面处,组织细密,晶粒较小。镀层由沉积层和过渡层构成,Ti含量由表至里逐渐降低,过渡层的存在有利于提高膜-基结合力。镀层显微硬度呈梯度分布,表面显微硬度约为铜基材的3倍。
The Cu-Ti alloy thin films were prepared on the copper substrate by the same-base alloy arc ion plating method. The effects of arc current and target-substrate distance on the film quality and deposition rate were studied. The results show that the deposition rate increases with the increase of arc current and decreases with the increase of the target-base distance. The near surface of the coating is lamellar structure with particles on the surface of the coating, indicating that Cu -Ti alloy droplets; near the interface, the organization of fine, smaller grains. The coating is composed of the deposition layer and the transition layer. The content of Ti gradually decreases from the top to the bottom, and the presence of the transition layer helps to improve the film-base bonding force. Microhardness coating gradient distribution, the surface microhardness of about 3 times the copper substrate.