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采用纯Cu箔为中间层在真空钼丝烧结炉中进行TC4和304的扩散连接,利用光学显微镜(OM)、扫描电子显微镜(SEM)和能谱仪(EDS)对接头组织和成分进行表征,并测试结合区的显微硬度。结果表明,Cu作为中间层有效抑制了Ti与Fe、Cr的互扩散,不同焊接温度下均形成3个新相层。A层主要为富集Ti、Cu形成的混合Fe基固溶体;B层主要为TiCu金属间化合物、β-Ti(Fe)及Fe-Cu共析混合物;C层主要是β-Ti为基的混合固溶体和少量Ti-Cu化合物。过渡层生成Cu Ti2、Cu3Ti2,主要分布在B、C层。焊接温度为1 050℃、保温为60 min时,焊接缺陷较少,具有良好的焊接质量。结合区厚度适中,组织分布较均匀,显微硬度在A/B界面附近达到峰值,为667.2HV。
Pure Cu foil was used as the intermediate layer to diffuse and connect TC4 and 304 in a vacuum molybdenum wire sintering furnace. The microstructure and composition of the joints were characterized by optical microscope (OM), scanning electron microscopy (SEM) and energy dispersive spectrometer (EDS) And test the microhardness of the binding zone. The results show that Cu intercalation effectively suppresses the interdiffusion of Ti, Fe and Cr. Three new phases are formed at different welding temperatures. The A layer is mainly a mixed Fe-based solid solution enriched with Ti and Cu; the B layer is mainly composed of TiCu intermetallic compounds, β-Ti (Fe) and Fe-Cu eutectoid mixtures; and the C layer is mainly β-Ti based Solid solution and a small amount of Ti-Cu compounds. Cu Ti2 and Cu3Ti2 are formed in the transitional layer, mainly distributed in layers B and C. Welding temperature of 1 050 ℃, 60min insulation, less welding defects, with good welding quality. The thickness of the binding zone is moderate, and the tissue distribution is more uniform. The microhardness reaches the peak near A / B interface, which is 667.2HV.