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概述了超微细线路PCB的非蚀刻附着性促进处理工艺(NEAP)和使用NEAP工艺处理的附着性机理、表面特性,附着强度,阻焊应用和高频特性。
The non-etching adhesion promoting process (NEAP) of ultrafine circuit PCB and the adhesion mechanism, surface characteristics, adhesion strength, solder mask application and high frequency characteristics of NEAP process are summarized.